高频互连线的分布参数特征分析及建模

The Distributed Parameter Analysis and Modeling for High-frequency Interconnect

无论是片上互连还是板上互连,电路互连线的分布参数将能引起高速数字信号的完整性问题和高频模拟信号的寄生效应,建立互连线新模型是适应电路系统工作日益高频化的需要。研究基于导体中电涡流理论,定性分析互连线等效阻抗随频率的变化规律,建立一种新型互连线RL集总参数模型。并根据此模型对直径为0.04 mm、长度为2 cm的互连线在不同频率下进行定量仿真分析,结果表明:互连线寄生电阻随频率升高而增大、寄生电感随频率升高而减小,整体阻抗随频率升高而增大。这为信号完整性分析和射频电路设计提供依据。

Whether it is on chip or board, the distributed parameter of circuit interconnect will cause integrity problems for high - speed digital signals and parasitic effects for high frequency analog signals. Establishment new interconnect model is a need to adapted to the increasingly high - frequency circuit system operation. Based on conductor eddy current theory, the equivalent impedance variation with frequency for interconnects has been qualitative analy- sis, and RL lumped parameter model was established. According to this model, the interconnect with diameter -0. 04mm,length -2cm was simulated quantitatively at different frequencies. The results showed that the interconnect parasitic resistance increases with increasing frequency, while the parasitic inductance decrease with increasing frequency, and the overall impedance increases with increasing frequency. That will provides the basis for signal integrity analysis and RF circuit design.