超厚母板生产工艺探讨

Study of printed circuit board manufacture process with ultra-thick basal plate

在超厚母板生产工艺中,由于其板厚度>5 mm,已超出常规生产设备最大生产厚度,给生产带来一系列的难度,文章主要介绍了一款厚度8.0 mm的超厚母板生产工艺方法,分别从内层制作、压合、钻孔、电镀、背钻等方面剖析,以及在生产过程中过水平线、转运等给出了可行性生产方法,大幅提高了生产品质、生产效率。

There is series of difficulties in printed circuit board（PCB） manufacture process with ultra-thick basal plate whose thickness is greater than 5 millimeter because it is beyond the capability of production equipment seriously. In this article, the manufacturing process of PCB with ultra-thick basal plate is introduced and analyzed in the process of the inner production, pressing, drilling, electroplating, drilling with governable depth, etc. And the quality and efficiency of production are improved by putting forward the feasible solution of manufacturing in horizontal line and the transfer way between different production processes.