Internal stress analysis of electroplated films based on electron theory

基于电子理论的电镀薄膜内应力分析（英文）

Cu films on Fe, Ni and Ag substrates, Ni films on Fe and Ag substrates, Ag film on Cu substrate, Cr film on Fe substrate, Ag film on Ag substrate, Ni film on Ni substrate and Cu film on Cu substrate were deposited by electroplating. The average internal stress in all films, except Cr, was in-situ measured by the cantilever beam test. The interfacial stress is very large in the films with different materials with substrates and is zero in the films with the same material with substrates. The interfacial stress character obtained from the cantilever beam bending direction is consistent with that obtained from the modified Thomas–Fermi–Dirac electron theory.

用电镀方法在Fe、Ni和Ag基体上沉积Cu膜,在Fe和Ag基体上沉积Ni膜,在Cu基体上沉积Ag膜,在Fe基体沉积Cr膜,以及在Ag基体上沉积Ag膜,在Ni基体上沉积Ni膜和在Cu基体上沉积Cu膜。采用悬臂梁法原位测量了除Cr膜外其他薄膜的平均内应力。结果表明,薄膜和基体为异种材料时薄膜内界面应力很大,而为同种材料时界面应力为零。由悬臂梁的弯曲方向得到的界面应力的性质与由改进的Thomas-Fermi-Dirac电子理论得到的结果一致。