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MEMS晶圆级测试系统现状及未来展望 被引量:4

Present situation and future prospect of MEMS wafer level test system
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摘要 微机电系统(MEMS)产品的广泛应用使得晶圆级测试技术必要性日益凸显。分析了国内和国际MEMS晶圆级测试系统硬件和MEMS晶圆级测试技术的现状。参照国际上利用RM8096/8097标准物质(RM)对MEMS产品进行计量测试的方法,给出了针对我国现有MEMS晶圆级测试系统校准问题的初步解决方案。并指出了该类测试系统今后向着标准化模块化方向发展的趋势。 Wide application of MEMS products makes it necessary to study on wafer level testing technology.Domestic international present situation of hardware of MEMS wafer level test system and testing technology of MEMS wafer level are analyzed. Referring to RM8096 /8097 reference material( RM),a preliminary solution for calibration problem of system is given. Trend of standardization and modularization that testing system can expand in the future is pointed out.
出处 《传感器与微系统》 CSCD 2016年第10期1-3,7,共4页 Transducer and Microsystem Technologies
关键词 微机电系统 晶圆级测试系统 测试技术 标准物质 MEMS wafer level test system testing technology reference material(RM)
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