高集成度多光谱TDI CCD焦平面系统

Highly integrated multi-spectral TDI CCD focal plane system

提出了一种高集成度TDI CCD焦平面系统,成功应用TDI CCD驱动单元厚膜集成模块完成了具有16路CCD信号输出、像元读出频率20 MHz的高集成度高速多光谱TDI CCD焦平面系统的研制。通过采用双通道CCD信号处理模拟前端、厚膜集成驱动单元模块、高速LVDS图像数据传输接口以及机、电、热一体化仿真设计方法,极大提高了TDI CCD焦平面系统的集成度,降低了系统互连的复杂程度。系统共有4路图像数据传输接口,单路传输能力达到1.6-2.5 Gbps,最高可实现10 Gbps的图像数据带宽,在保证高数据率的同时,提高了数据传输的抗干扰能力。阐述了系统设计方案及多光谱TDI CCD探测器工作原理,并对其中的机电集成设计、驱动单元厚膜集成技术以及高速串行传输总线等关键技术进行了分析描述。通过采用TDI CCD传函测试片对系统进行了测试,焦平面全系统调制传函平均为0.511。

Highly integrated TDI CCD focal plane system was proposed, the thick-film integrated module of TDI CCD driving unit is applied successfully in the domestic. The research was finished on highly integrated high-speed and multi-spectral TDI CCD focal plane system, including 16 channel CCD output signals and pixel read-out frequency of 20 MHz. The use of dual-channel CCD signal processing analog front end, thick-film integrated drive unit module, high-speed image data transmission LVDS interface and mechanical, electrical, thermal integrated and simulated design approach greatly increases the integration of TDI CCD focal plane system and reduces the complexity of system interconnection. The system includes four image data transmission interfaces, each transmission capacity is 1.6 Gbps to 2.5 Gbps. It is up to 10 Gbps total of the image data bandwidth, ensuring high data rates and improving anti- interference performance of data transmission. The system design and multi-spectral TDI CCD detector working principle was described. As the key technologies, mechanical and electrical integrated design, thick-film integrated technology of drive unit and high-speed serial transmission bus technology were analyzed. The system was tested by using TDI CCD transfer function test chip, average value of modulation transfer function is 0.511 in the total focal plane system.