铜基体表面粗糙度对其铁接触诱发化学镀镍的影响

Influence of surface roughness of copper substrate on its electroless nick plating pre-induced by iron contact

借助扫描电镜(SEM)、能谱仪(EDS)、电化学工作站、X射线荧光测厚仪等设备,探究不同粗糙度铜基材上铁接触诱发化学镀镍过程中活性镍原子的形成、分布规律及其对镍层厚度和微观结构的影响。结果表明,随基体粗糙度降低,单位时间内形成的活性镍原子先增多后减少。活性镍原子在经800#砂纸打磨的铜基体表面(粗糙度为0.245μm)的形成速率最快,并疏密相间地分布在整个平面。初期形成的活性镍原子越多,所得镀层就越厚。与相同条件下钯活化法化学镀镍层相比,铁接触诱发化学镀镍层更平整。

The formation and distribution of active nickel atoms on copper substrates with different surface roughness during electroless nickel plating induced by iron contract and the effect of active nickel atoms on thickness and microstructure of nickel coating were studied by using scanning electron microscope （SEM）, energy-dispersive spectroscope （EDS）, electrochemical workstation and X-ray fluorescence thickness tester. The results indicated that active nickel atoms formed per unit time increase firstly and then decrease with the decreasing of roughness of the substrate. The active nickel atoms are formed fastest on copper substrate polished using 800# sandpaper, which has a surface roughness of 0.245 gin, and distributed in a loose-to-compact way. The more active nickel atoms formed initially are, the thicker the nickel coating will be. Under the same electroless plating conditions, the iron contact-induced electroless nickel coating is smoother than the palladium-activated one.