基于炭黑导电碳层电镀制备泡沫铜

Preparation of copper foam by electroplating with a conductive carbon black layer

以聚氨酯泡沫为基体，先浸渍炭黑浆料在聚氨酯泡沫表面制备导电碳层，再依次通过预镀铜和酸性镀铜得到镀铜层，最后焚烧得到泡沫铜。利用数码显微镜和扫描电子显微镜（SEM）观察聚氨酯泡沫表面导电碳层和镀铜层的形貌，研究了炭黑浸渍次数对聚氨酯泡沫导电性的影响，以及预镀铜工艺参数对电镀泡沫铜形貌的影响。结果表明：通过浸渍2次炭黑浆料制备的导电碳层可明显增加聚氨酯的导电性。预镀铜的较佳工艺条件为：CuSO4·5H2O 100g／L，NaCl 0．6g／L，浓硫酸25mL／L，十二烷基硫酸钠0．05g／L，PEG6000．15g／L，DETU 0．01g／L，电流0．5A，温度25℃，搅拌速率10r／min。在最优条件下，通过15min的预镀铜和10min酸性镀铜后，铜层厚度为60～110μm。本工艺利用炭黑浆料浸渍法制备导电层，可简化泡沫铜的制备过程。

Copper foam was prepared using polyurethane foam as matrix as follows： conductive layer was firstly obtained on polyurethane foam by dipping it into carbon black slurry, then copper coating were formed through copper pre-electroplating followed by acid copper electroplating, and copper foam was obtained finally by incineration. The morphologies of conductive carbon layer and copper coating on polyurethane foam were analyzed using digital microscope and scanning electron microscope. The effect of the number of dipping times on the conductivity of polyurethane foam was studied. The effects of process parameters of copper pre-plating on the morphology of copper foam were studied. The results showed that the conductivity of polyurethane foam can be improved significantly by formation of conductive carbon layer prepared by dipping polyurethane foam into carbon black slurry twice. The optimal process conditions of copper pre-plating are as follows CuSO4· 5H2O 100 g/L, NaC1 0.6 g/L, concentrated sulfuric acid 25 mL/L, sodium dodecyl sulfate 0.05 g/L, PEG600 0.15 g/L, N,N-diethyl thiourea （DETU） 0.01 g/L, current density 0.5 A, temperature 25 ℃, and stirring rate 10 r/rain. The thickness of copper coating obtained by copper pre-plating for 15 min followed by acid copper electroplating for 10 min is 60-110 μm. The preparation procedure of copper foam can be simplified for the conductive layer in the present paper is prepared by dipping with carbon black slurry.