RZJ-304光刻胶压电雾化喷涂工艺及其应用

Process for piezoelectric spray coating of RZJ-304 photoresist and its application

在自主搭建的压电雾化喷涂系统上,以RZJ-304正性光刻胶为研究对象,圆形抛光硅片为基材,研究了稀释体积比、预热温度以及喷涂层数对光刻胶薄膜平均厚度及均匀性的影响,并得到最佳工艺参数。以具有方形结构的抛光硅片为基材,分别进行压电雾化喷涂法和离心旋转法涂胶,并进行图案光刻,结果表明压电雾化喷涂法可以在非圆形形貌上得到清晰完整的图案,克服了传统离心旋转法无法在非圆形面上涂胶的缺陷,验证了压电雾化喷涂法在非圆形形貌应用中的可行性。

The effects of dilution volume ratio, preheating temperature and spray layer number on average thickness and uniformity of the film of RZJ-304 positive photoresist on polished round silicon wafer as substrate were studied by using a home-built piezoelectric spraying system and the optimal process parameters were determined. The polished silicon wafers with square patterns were coated with RZJ-304 by centrifugal spinning and piezoelectric spraying respectively and then photoetched. The results showed that clear and complete patterns can be formed on noncircular structures by piezoelectric spraying, overcoming the problem that noncircular surface cannot be coated by centrifugal spinning method and proving the feasibility of piezoelectric spraying for noncircular configurations.