高强高导铜合金的制备技术及发展趋势

Preparative Technique and Development Tendency of High-strength and High-conductivity Copper Alloy

文章综述了高强高导铜合金的发展历程及其强化机制,以及不同强化机理对合金强度、导电性的相关影响,主要强化机制有固溶强化、第二相析出强化、弥散强化、细晶强化、加工硬化、复合强化等多种,并对处理工艺进行了一定的对比总结,展望了高强高导铜合金的发展趋势。

The development history and some strength mechanisms in high-strength and high-conductivity copper alloys were reviewed, and the influences of the mechanisms on the strength and conductivity of the alloys were introduced. Several processing methods were introduced for strength mechanisms, such as solution strengthening, the second phase precipitation strengthening, dispersion Strengthening, fine crystal strengthening, work-hardening, compound hardening, contrast and summarize the treatment process, the development tendency on high-strength and high-conductivity copper alloy.