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三角玻璃型LED灯丝灯的设计 被引量:2

Design of LED Filament Bulb with Triangle Glass
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摘要 设计了一款LED三角玻璃灯丝灯,利用艺术造型玻璃作为散热体与灯泡外壳,加长的LED灯丝光源由43颗芯片串联而成,由市电整流后直接驱动。LED灯丝的两个电极置于单端。用ANSYS有限元方法模拟了此款玻璃球泡灯丝灯在不同平均电流下的LED结温,采用正向电压法测量了此款玻璃灯的LED结温,结果表明:加长的LED灯丝可采用单端供电纯阻驱动,所设计的三角玻璃灯丝灯推荐使用的平均电流为10 m A,在此电流下结温为91.2℃,在保证使用寿命的前提下功率比传统灯丝球泡灯提高了25%。 Using art form glass as radiating body and bulb shell, a kind of new LED filament bulb with triangle glass was designed. The lengthened LED filament lighting source adopts 43 LED chips in series connection to match AC electric supply. Two electrodes of LED filament are arranged on the same end. The LED junction temperature of the glass bulb filament lamp with different average current was simulated by ANSYS finite element method and was measured by the forward voltage method respectively. The results showed that the lengthened LED filament can be driven directly by AC 220 V power supply with resistive load. When the driving current of LED filament bulb with triangle glass body is 10 mA, the LED junction temperature is 91.2℃. The rated power is 25% higher than that of traditional LED filament bulb in the condition of assuring reliability and working life.
作者 张红林 张夕奎 区燕杰 吴懿平 ZHANG Hong-lin ZHANG Xi-kui OU Yan-jie WU Yi-ping(l.Huazhong University of Science and Technology, Wuhan 430074, Chin Guangdong South China Institute of Semiconductor Optoelectronics, Jiangmen 529080, China Jiangmen Mailanrui Lighting appliance Co. Ltd., Jiangmen 529000, China)
出处 《电子工艺技术》 2016年第5期249-252,共4页 Electronics Process Technology
基金 广东省产学研计划基金项目(项目编号:2013B090600031)
关键词 LED灯丝 三角玻璃散热 LED结温 纯阻驱动 LED filament triangle glass heat disspation LED junction temperature resistive load
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  • 1颜重光.技术创新的LED灯丝球泡灯[J].中国照明电器,2014(2):26-28. 被引量:7
  • 2陈挺,陈志忠,林亮,童玉珍,秦志新,张国义.GaN基白光LED的结温测量[J].发光学报,2006,27(3):407-412. 被引量:44
  • 3卢文全,张仲生.新型大功率白光LED组件[J].中国照明电器,2007(6):12-13. 被引量:11
  • 4Ishikawa H, Fujiwara T, Fukiwara K, et al. Accelerated aging test of GalxAI xAs DH lasers[J]. APPI Phy Lett, 1999, 50:2518.
  • 5Chhajed S, Xi Y, Th Gessmann, et al. Junction temperature in light- emitting diodes assessed by different methods [J]. ProeSPIE, 2005, 5739: 16224.
  • 6EIA/JEDEC Standard JESD5 1-1 Integrated Circuits Thermal Measurement Method Electrical Test Method(Single Semiconductor Device) [S]. USA: ELECTRONIC INDUSTRIES ALLIANCE, 1995: 3-7.
  • 7Han-Youl Ryu, Kyoung-Ho Ha. Measurement of junction temperature in GaN-based laser diodes using voltage-temperature characteristics[J]. Appl. Phys Lett, 2005,87:093506.
  • 8Hartman R L, Dixon R W. Reliability of D H GaAs lasers at elevated temperatures[J]. Appl Phys Lett, 1975: 26: 239.
  • 9Gu Yiming, Narendnan N. A non-contact method for determining junction temperature of phosphor-converte white LEDs[J]. Proc Spie, 2004, 5187: 107-114.
  • 10Grove A S. Physics and Technology of Semiconductor Devices[M]. Beijing: Science Press, 1976: 232-234.

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