柔性电子封装技术研究进展与展望

Research Progress and Prospect of Package Technology for Flexible Electronics

柔性电子以其独特的柔性/延展性,在信息、能源、医疗与国防等领域具有广泛的应用前景。而柔性电子技术的可弯曲及可延展特性对其封装技术提出了更高要求。以柔性电子封装技术为重点,综述柔性电子制造中的特殊工艺制程,包括倒装芯片技术和CIF(Chip in Flex)封装技术的研究进展,并展望柔性电子中封装技术的发展趋势。

Due to its unique flexibility and ductility, flexible electronics has broad prospects in information, energy, medical treatment, national defense and other application. Due to its flexible and extensible characteristics, flexible electronic also puts forward higher requirements on its packaging technology. Mainly summary the special packaging process during the fabrication of flexible electronics, including flip chip and Chip in Flex （CIF） packaging technologies in flexible electronic packaging, and forecast its development trends of the electronic technology of flexible electronics.