回流焊焊膏喷印参数研究

Investigation on Jet Printing Parameter of Paste during Reflow Process

焊膏喷印技术由于其优良特点近年来得到了广泛关注。对回流焊中焊膏的喷印参数进行了探讨。首先以0805贴片电阻为例,选择了不同的喷印面积和焊膏喷印量进行回流焊。焊后采用显微镜对焊点外观进行检查,采用X光机对焊点缺陷进行了探测。依据相关标准,得到了该元件最佳的焊膏喷印面积与喷印量。最后采用相似试验,给出了其他器件最佳的焊膏喷印参数。

Paste jet printing technology receives more focus for its perfect character recently. The paste jet printing parameter was investigated during reflow process. Firstly, the 0805 chip resistor was selected as the object. Different jet print area and volume were used and the solder joint was carefully inspected using the microscope and X-ray detector after reflow. The best paste jet printing area and volume were obtained dependent on relevant standard. At last, the parameter for other components was listed based on the similar test.