摘要
高密度电路板组装工艺更为复杂,极易带来各种焊接缺陷,造成电路板故障。准确判断故障的定位和原因就成为一个很重要的问题。综合采用了边界扫描、X光检测和金相剖切等检验技术,采用了科学排除法,对故障的位置和原因进行了准确定位。在返修过程中,采用了先进的返修设备和具有国家专利的植球工具,采用了一些有效的技巧和方法,大大提高了高密度电路板返修的成功率。
The assembly process of high density circuit board is more complex, it is easy to bring some kinds of soldering defects, resulting in circuit board failure. It is important to accurately judge the location and reason of failure. The PCB defect location and reason were found by adopting boundary scan technology, X-ray inspection technology, metallographic cutting technology, and scientific exclusion method. The repair success rate of high density circuit board was greatly improved by adopting modern reworking equipment and reball tool with a national patent, and some effective skills.
作者
李佳
LI Jia(No. 38 Research Institute of CETC, Hefei 230088, Chin)
出处
《电子工艺技术》
2016年第5期299-302,共4页
Electronics Process Technology
关键词
高密度电路板
故障定位
边界扫描
金相剖切
植球
high density PCB
failure location
boundary scan
metallographic cutting
reball
