摘要
功放芯片是现代雷达和电子战设备最重要的发热器件,其中Ga N芯片在T/R组件中得到了越来越广泛的应用。文中针对Ga N芯片热耗大、热流密度高等特点,探讨了从两相流冷却技术角度解决散热问题的工程可行性。分析了两相流冷却原理,提出了用菱形肋微通道冷板来强化对流沸腾换热的方法,并搭建了试验系统对散热性能进行了测试。试验结果证明了两相流冷却技术应用于高热流密度功放芯片散热的有效性和可行性,为未来高热流密度功放芯片的散热提供了可行的解决方案。
The power amplifier chip is the most important heating electronic component of the modem radar and electronic warfare equipment. And the GaN chip is more and more widely used in the T/R module. Since high-power density of GaN chip constitutes a great challenge to thermal design, the two-phase flow cooling technology is discussed in this paper to solve the heat dissipation. The theory of two-phase flow cooling in the cold plate is introduced. A new method of enhancing boiling heat transfer by using rhombus channel is pro- posed and the heat transfer performance is tested. The results show that the new method is very effective and feasible and the two-phase flow cooling technology is a viable solution to heat dissipation of high heat flux electronics in the future.
出处
《电子机械工程》
2016年第4期16-19,61,共5页
Electro-Mechanical Engineering
