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无机填料对EVA热熔胶性能的影响 被引量:8

Influences of inorganic fillers on properties of EVA hot melt adhesive
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摘要 通过固定EVA(乙烯-醋酸乙烯酯共聚物)、石蜡、PE(聚乙烯)蜡、松香甘油酯和抗氧剂的比例,改变无机填料的掺量及类型,制备了相应的HMA(热熔胶)。研究结果表明:随着无机填料掺量的增加,HMA的黏度、拉伸强度和硬度上升,180°剥离强度呈先升后降态势,断裂伸长率下降;碳酸钙、滑石粉和高岭土这3种无机填料对HMA的软化点有不同的影响,软化点随碳酸钙掺量增加而升高,随滑石粉掺量增加而下降,随高岭土掺量增加而变化较小;HMA各方面的性能随无机填料粒径变小而提高。 The corresponding HMA (hot melt adhesive) was prepared when the ratio among EVA (ethylenevinyl acetate copolymer) , paraffin, PE (polyethylene) wax, rosin glyceride and antioxidant was fixed, the contents and types of inorganic fillers were changed. The research results showed that the HMA' s viscosity, tensile strength and hardness were increased, 180°-peeling strength had the trend of rise-fall, and the elongation at break was decreased with increasing inorganic filler content. The influences of three fillers (such as calcium carbonate, talcum powder and kaolin) on HMA's softening point were different, the softening point was increased with increasing calcium carbonate content but it was decreased with increasing talcum powder content, and its change was smaller with increasing kaolin content. The HMA' s properties in all aspects were increased with decreasing inorganic filler particle size.
作者 李申喆 汪济奎 郭卫红 陈慧 王芯蕊 蒋仙友 Li Shenzhe Wang Jikui Guo Weihong Chen Hui Wang Xinrui Jiang Xianyou(East China University of Science and Technology, Shanghai 200237, China Zhejiang Good Hot Melt Adhesive Co., Ltd.,Tongxiang 31d.512, China)
出处 《中国胶粘剂》 CAS 北大核心 2016年第10期36-39,共4页 China Adhesives
基金 江苏省科技计划项目(国际科技合作计划BZ2013010) 上海市重点学科资助项目(B502)
关键词 热熔胶 乙烯-醋酸乙烯酯共聚物 无机填料 粒径 hot melt adhesive(HMA) ethylene-vinyl acetate copolymer(EVA) inorganic filler particle size
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  • 1徐雪青,沈辉,邓润坤,黎宪静.若干太阳电池封装用粘接剂的耐老化性能评价[J].太阳能学报,2004,25(4):438-442. 被引量:16
  • 2杨玉昆 余云照.合成胶粘剂[M].北京:科学出版社,1985.568.
  • 3高学敏 黄世德.粘接和粘接手册[M].成都:四川科学技术出版社,1990..
  • 4李子东 李广宇 于敏.实用胶粘剂原材料手册[M].北京:国防工业出版社,1997,7..
  • 5Arkles B.Tailoring surfaces with silanes[J].Chemtech, 1977,7(12) :766-778.
  • 6Pern F J, Glick S H.Adbesion strength study of EVA encapsulants on glass substrates[C]//Proceedings of the National Center for Photovoltaics and Solar Program Review Meeting. Denver: National Renewable Energy Laboratory, 2003.
  • 7田甜,彭勃,余鲜桃.硅烷偶联剂对环氧胶粘剂力学性能的影响[C]//第三届中国建筑胶粘剂发展论坛论文集.南京:中国化工学会,2011:122-128.
  • 8Arkles B.Silane coupling agents : Connecting across bound- aries[M].USA : Gelest Inc., 2006.
  • 9MacMillan J H.Using silanes as adhesion promoters[EB/OL]. 2001-03-10[2013-10-30].https ://archive.org/details/ UsingSilanesAsAdhesionPromoters.
  • 10Venkateswara Rao A, Latthe S S, Nadargi D Y, et al.Prepa- ration of MTMS based transparent superhydrophobic silica films by sol-gel method[J].Journal of Colloid and Interface Science, 2009,332(2) : 484-490.

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