芯片拾取头旋转精度测量方法研究

Study of The Circumrotation Accuracy Measure of Chip Picking And Placing Machine

在全自动贴片设备中,采用吸头吸取芯片的方式是常用功能之一。由于对位高精度要求,吸头通常具有旋转功能,旋转精度是非常重要的技术指标,如何判定显得尤为重要,因此吸头旋转精度的测量方法成为关键技术之一。以精密组装系统的吸附机构为例,采用5种方法测量芯片拾取头的旋转精度,通过实际测量与数据分析,比较了几种方法的优缺点,推荐了较为可信的测试方法,可为类似结构的测试提供理论与实践依据。

In the fully automatic equipment, the use of suction head picking and placing chip is one of the commonly used functions. Due to the high alignment accuracy requirements, suction head usually has function of rotation, rotation accuracy is very important technical indicators, to determine how to appear particularly important. Therefore, the head rotation accuracy measurement method has become the key technology. The adsorption mechanism of the precision assembly system for example , by 5 kinds of method for measuring the chip pickup head rotation accuracy, through the actual measurement and data analysis, comparing the advantages and disadvantages of several methods and more reliable testing method is recommended, a more reliable test method is recommended, which can provide theoretical and practical basis for the test of similar structure.