塑封器件分层问题浅析

The Research on Delamination of Plastic Packaging Device

在现行引线框架的IC封装模式过程中,分层是一种重大的质量异常现象,且是产品本身可靠性的绝对关键因素。而在生产过程中如何防患于未然,提高合格率,是急需解决的问题。概述分层及分层分类,提出影响分层的主要因素,并给出了避免塑封器件分层的有效措施,降低产品失效的几率,提高可靠性。

At present, the delamination still is a major concern in terms of quality and reliability for lead frame packaging. How to avoid the cause and promoting yield rate in which to become a very important issue and need to be improve at continuously. This article first summarized the delamination, and expounded the classification of delamination in detail, put forward the main factors for device failure, and some effective measure avoiding the device delamination.