铜盐种类及表面活性剂对制备超细铜粉的影响

Influence of Copper Salt Types and Surfactant on Preparing Ultrafine Copper Powder

采用化学还原法制备超细铜粉,通过条件试验研究了铜盐种类(硫酸铜、硝酸铜、乙酸铜、氯化铜)和表面活性剂SDS(全称"十二烷基硫酸钠")对制备超细铜粉的影响。利用X射线衍射仪、扫描电镜、激光粒度分布仪及数字欧姆表,对超细铜粉的物相、形貌、粒径分布和导电性进行分析。结果表明:添加SDS后,铜粉表面变光滑,粒径分布变窄,松装密度变大,导电性变好。铜盐种类不同,其对铜粉表面、粒径分布、松装密度及导电性等性能影响也不同,其中以硫酸铜为原料制备的铜粉性能最佳,其次是硝酸铜、乙酸铜,性能最差的是氯化铜原料。铜粉性能的差异与反应体系中SDS的作用机理以及铜盐中阴离子半径和浓度有关。

The chemical reduction method was adopted to prepare ultrafine copper powder. The effects of copper salt types （copper sulfate, copper nitrate, copper acetate and copper chloride） and surfactant SDS （ full name ＇sodium dodecyl sulfate＇ ） on preparing ultrafine copper powder were investigated by condition experiments. XRD, SEM, laser particle size distribution tester and digital ohmmeter were used to analyze the phase, morphology, size distribution and electrical conductivity of ultrafine copper powder. The results show that after adding SDS, the copper powder surface becomes smooth, the distribution of particle size becomes narrow, the apparent density increases and the electrical conductivity becomes well. Different kinds of copper salts have different effects on the surface, particle size distribution, apparent density and electrical conductivity of copper powder. Among them, the best copper powder performance is prepared by copper sulfate raw material, followed by copper nitrate and copper acetate, the worst performance is prepared by copper chloride raw material. The difference of copper powder performance may be relate to SDS function mechanism in reaction system and anionic radius in the copper salt as well as the concentration.