以废旧电路板为原料制备超细铜粉的工艺研究

Study on preparation of ultrafine copper powder from waste circuit board

研究了一种从废旧电路板中湿法回收铜并制备超细铜粉的新工艺。首先物理分选出含铜的组分,再采用硫酸铜-盐酸-正丁胺混合体系浸出铜,萃取-反萃工艺获得CuSO_4·5H_2O晶体,以此作为制备超细铜粉的原料。后用葡萄糖预还原,再以抗坏血酸为还原剂,进行二次还原,获得200 nm至1μm不同粒径范围的超细铜粉。制备出的铜粉粒度均匀,结晶度高,分散性好,无团聚现象,实现了废旧电路板的高附加值回收利用,增加了工艺的竞争优势。

A new technology of hydrometallurgical recovery of copper and preparation of ultrafine copper powder from waste printed circuit board was studied in this paper. Firstly physical method was utilized to sort out copper components, then copper sulfate-hydrochloric acid-butylamine mixed system was utilized to leach copper, then extraction-stripping process was utilized to obtain CuSO4 ·5H2O crystals, as the raw material for the preparation of ultrafine copper powder. Next prereduced with glucose, at last make use of ascorbic acid as a reducing agent to carry out the two-step reduction, different particle size range from 200 nm to 1 μm ultrafine copper powder was gained, which have uniform particle size, high crystallinity, good dispersion, no agglomeration. A high value-added recycling from waste printed circuit board was achieved, the technological superiority of competition was increased.