摘要
介绍了银浆贯孔印制板主要特性、技术指标及产品应用范围,对CPCA 6042-2016《银浆贯孔印制板》标准中对银浆贯孔印制板主要特性要求及相关试验方法进行了描述。
This paper introduces the main characteristics, technical specifications and the application range of the silver paste printed board. The main characteristic requirements and related test methods are described for the CPCA standard of"silver paste through hole printed board".
出处
《印制电路信息》
2016年第11期9-12,共4页
Printed Circuit Information
关键词
银浆贯孔印制板
银浆贯孔电阻
电阻变化率
银迁移
Silver Through-Hole PCB
Silver Through-Hole Resistance
The Change of The Resistance
Silver Migration