摘要
文章将就湿法贴膜与普通干膜对线路的影响进行解析,分析湿法干膜在精细线路制作过程中针对凹陷和划伤起到很好的填充能力,保证了高效的品质及提升生产效率。
This article discusses wet film and ordinary dry film and analyze the impact on line. It makes analysis of wet dry film in fine lines for sag and scratches in the process of production which has very good filling ability, ensures the high quality and improves production efficiency.
出处
《印制电路信息》
2016年第11期32-35,共4页
Printed Circuit Information
关键词
湿压
干膜
填充能力
Wet
Dry Film
Pressure Filling Ability