摘要
电子产品无铅化的实施给电子制造产业带来一个重大转变。本文介绍了无铅、有铅焊接的本质区别,通过耐热性、CAF、可加工性等条件,对无铅基材的选用标准进行探究,找出无铅组装对PCB的要求。
Lead free implementation in electronic product has brought a great change to the electronic manufacturing industry. This study explains the difference between traditional welding and lead-free welding. It also explores the standards in selecting LF FR-4 based on context analysis of heat resistance, CAF, and the process ability of the material. According to the context analysis and the standards in LF FR-4 selection, this study presents the requirement of PCB for Lead-free assembling.
出处
《印制电路信息》
2016年第11期58-63,共6页
Printed Circuit Information
关键词
无铅
标准
耐热性
导电阳极丝
可加工性
Lead Free
Standard
Heat Resistance
Conductive Anodic Filament
Process Ability
