双路径复杂互连结构串扰分析及等效电路研究

Crosstalk Analysis and Equivalent Circuit Study of Dual-path Complex Interconnect Structure

文中建立了由过孔、焊点、印制线构成的高速电路板双路径复杂互连结构的单元模型。在1～10GHz频率范围内分析其近端串扰的传输性能。结果表明：随着路径间距的减小。双路径复杂互连结构的近端串扰越强。提出了双路径复杂互连结构的等效电路模型，其近端串扰在1～10GHz频率范围内与物理模型仿真结果相差不超过3％。

A high-speed circuit board complex interconnect structural unit model was established,which consisted of the via holes, the welding spots and the printed lines.The transmission performance at frequency range from 1 GHz to 10 GHz of the nearend crosstalk of the double path complex interconnection structure were analyzed.The results show that, along with the decrease of the spacing of the path, the near-end crosstalk of the double path complex interconnection structure become stronger. An equivalent circuit model of the double path complex interconnect structure was presented, which shows that the difference on nearend crosstalk in 1 - 10 GHz frequency range is not more than 3% compared with the simulation result of physical model.