一种适用于大孔及高度密集孔PCB板塞孔树脂的研制

Development of plugging resin used for PCB with large or highly dense holes

文章以双酚A型环氧树脂为基本树脂组分通过改性处理使得BTH-8000OMB-201型塞孔树脂具有较高的耐热性，Tg值在166℃～173℃之间。研究结果表明，纳米添加剂的使用大大提高了BTH-8000OMB-201型塞孔树脂的触变性，对降低网印塞孔后树脂的扩散起到了关键作用。通过对BTH-8000OMB-201型塞孔树脂的电性能测试，发现其介电常数和BTH-8000系列其它型号塞孔树脂相比，依然保持在一个较低的数值，即3．59（1MHz），这远低于目前市场中使用的塞孔树脂产品以及行业标准，体积电阻率高达1．6×10^16Ω·cm，高于目前市场中使用的塞孔树脂产品，而吸水率仅为0．06％。这将大大地拓宽BTH-80000MB-201型塞孔树脂的应用范围。

BTH-8000 OMB-201 plugging resin has higher heat resistance and Tg values which are between 166 and 173 ℃（TMA） by using bisphenol A epoxy resin modified. The result indicated that not only can the application of nano-materials greatly improve the thixotropic index （TI） of the BTH-8000 OMB-201 plugging resin, but also does it plays the key role to decrease the diffusion of the plugging resin on the PCB after screen-printing. The result of electrical performance testing indicates that the dielectric permittivity is still a lower value, 3.59（1 MHz） compared to those of other BTH-8000 series plugging resins, which is lower far from that of the products used in the present market and the industry standards. Otherwise, volume resistivity reaches 1.6×10^16Ω· cm, which is also higher than the currently products used in the market. It is noteworthy that the water absorption of the cured substance for BTH-8000 OMB-201 plugging resin is only 0.06%. It will largely expand the applying environment of BTH-8000 OMB-201 plugging resin.