聚集性板面脏污形成机理与改善研究

Research of the mechanism and improving about the concentrative smudginess on the surface of board

图形电镀工艺产品，显影后图电前停放超过一定时间时，板面无干膜保护区域会出现聚集性黑色脏污，图形电镀完成后，此脏污会夹在铜层之间，影响板件外观且有潜在品质风险。本文通过研究，明确此类型脏污形成机理，并针对性制定改善措施，效果显著。

When the pattern plating products parking period of time after developing and before pattern plating, that some black concentrative smudginess appear at the unprotected area by dry film, and after pattern plating, the smudginess was folded in the electroplated copper layer. The smudginess infects the appearance of the board and brings some unknown or potential failure mode. According to the research of this paper, we know the engendering mechanization of the smudginess, and formulate the improving measures targeted, which brings the issue to a close, and the achievement is outstanding.