对流和整平剂协同对PCB通孔深镀能力的影响研究

Influence of the synergetic e ct of convection and leveler on the throwing power

PCB制造过程中，通孔电镀的质量决定了PCB的成品率和可靠性，而深镀能力（TP）是描述通孔电镀质量的一个重要指标，整平剂的加入极大地提高深镀能力，但整平剂的整平作用受对流的影响较大。因此，文章选择了一款较为稳定的电镀铜镀液体系，其中的整平剂为环氧乙烷亚胺共聚物（Eoim），将健那绿（JGB）作为对比整平剂，在哈林槽中采用不同鼓气方式进行电镀试验，以得到对流方式不同对深镀能力的影响，同时采用循环伏安法（CV）研究了Eoim和JGB在不同对流条件下的电化学行为，以得到不同对流方式对整平剂作用的影响，在本实验条件下，试验结果表明，采用阳极鼓气的方式能有效地提高深镀能力，同时JGB在弱对流条件下并没有明显的整平能力，而Eoim受对流影响较小。

The yield and reliability of Printed Circuit Boards （PCBs） are restricted by the quality of Plated Through Hole （PTH）, which largely depends on the throwing power （TP）. And leveler could raise TP effectively, while the leveling effect is greatly affected by convection condition. In this paper, a stable copper plating system, whose leveler is a polymer of epoxyethane and imine （Eoim）, is chosen and compared with another leveler JGB. Plating and CV experiments are employed to research the influence of different convection condition on TP and leveling effect, respectively. The results under the experimental conditions suggest that pumping air at anode could raise TP effectively, and convection has a great impact on JGB, which has no leveling effect in a weak convection condition.