摘要
封装基板的特点之一就是孔数多、孔径小，对于孔径小于100Hm的微孔基本全部采用激光加工。其中盲孔由于电镀铜与基铜之间结合力的可靠性问题，使得对盲孔加工过程控制更加困难。孔底铜层分离是导致盲孔可靠性的问题之一，文章通过对激光加工条件、除胶方式以及内层基铜粗糙度三个方面加以分析，并通过全因子试验证实了导致孔底分离不良的主要原因是孔底残胶，且除胶方式和基铜粗糙度是影响孔底铜层分离的显著因素。采用等离子千法除胶、使用内层基铜粗糙度较大的芯板同时增大下孔径将显著改善孔底分离不良。采用拔孔的方法可有效监控孔底分离不良。
Large quantities and small size holes is one of the features ofIC Substrate. The micro via are mainly producced by laser processing for the size less than 100 μm. The reliability problems of adhesive force between the electroplating of copper and base copper makes it harder for the control of the blind via processing. The blind via separation is one of the issues that effect the reliability of the blind via. This article analyses the laser processing conditions, dsemear methods as well as the base copper roughness from three aspects. In addition, this article confirms that the main reason which leads to the blind via separation is the resin in the bottom via through the full factorial experiment, furthermore, the desmear method and the base copper roughness is the significant factors influencing the separation. Using plasma, low profile copper and increasing the bottom via size at the same time will significantly improve the defection .Adopting the method of pulling off via can effectively monitor the defection.
出处
《印制电路信息》
2016年第A02期135-143,共9页
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