摘要
等离子体技术作为一种便捷、环保的处理技术已广泛应用于众多高技术产业中，而在印制电路板行业中主要作为处理钻孔残胶的一种重要手段。本文采用等离子均匀性方法研究了等离子体除胶过程中相关工艺参数对咬蚀速率的影响，分析了不同负载量对咬蚀速率的影响趋势。得出了等离子除胶过程中关键制作参数的最佳配置，得到了负载量同咬蚀速率间的对应关系方程，可为实际应用提供一定参考作用。
Plasma has been widely used in many high technology industries as a convenient and environmentally friendly processing technology; In the PCB industry, plasma is an important means to deal with the residual glue. In this paper, the effect of process parameters and loading on the ashing rate is studied by using orthogonal test. Receive the better mixture ratio of the key parameter in the process of ashing by plasma, the relationship equation of loading and ashing rate is also received and it can provide some reference for the actual application.
出处
《印制电路信息》
2016年第A02期162-169,共8页
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