刚挠结合板弯折解决方案研究

Rigid-flex bending solution research

随着电子产品向轻、薄、短、小、高密度、多功能发展，需要其关键电子部件印制电路板实现立体组装小型化，而传统单一刚性印制电路板因其硬度强，主要用来支撑元器件平面组装，挠性印制电路板因其挠折性好，主要用来实现刚性板组装之间的互连，急需将刚性和挠性这两类印制电路板组合在一起形成刚挠结合板来满足用户的需求实现立体组装小型化。刚挠结合板（Rigid Flex Printed Circuit Board），是由刚性和挠性线路图层用开窗粘接层压合在一起组成的以金属化孔形成导电连通的印制电路板，它的刚性部分主要承载元器件，挠性部分实现弯折传输功能。实现电子产品小型化需要立体组装，刚挠结合板是其必然选择，为满足用户不同机构安装需求，PCB厂商需提供叠层结构与弯折设计解决方案。

As electronic products develop toward to lighter, thinner, shorter, smaller, higher density, the need for the key part PCB to come true 3D miniaturization assembly. The traditional PCBs are high rigid and mainly load component on plane, and the ftex is flexible and mainly for connecting rigid boards, so it need strongly combining the two type products to meet the users requirement that come true 3D miniaturization assembly. Rigid Flex Printed Circuit Board is made from rigid core and flex core, by laminating and de-cap process, connecting by plated holes, rigid part components loading and flex part true bending for signal transmission. For miniaturization assembly, Rigid Flex Printed Circuit Board is natural trend. To meet user different mechanical assembly requirements, PCB suppliers need to provide stackup and bending design solutions.