应用于厚型气体电子倍增器的高耐压PCB研究

Research on high-withstand-voltage PCB applied to Thick Gaseous Electron Multiplier

厚型气体电子倍增器（Thick Gaseous Electron Multiplier，THGEM／TGEM）在高能物理实验中有广泛应用，如X射线、带电粒子及中子的探测和成像等领域。THGEM的制作通过印制电路的钻孔、蚀刻和外形等工艺来实现，并要求具有高耐压、强电场、小孔间距和高孔位精度等特点。本文将根据THGEM的以上特点，分析其对PCB在材料选择、设计和工艺制程等方面的特殊要求，并通过对比各条件的产品性能数据给出应用于高性能THGEM制作的PCB解决方莱。

THGEM is widely used in high energy physics experiments, such as X-ray, charged particles and neutron detection and imaging. THGEMs are manufactured by printed-circuit drilling, etching and milling technology. The requirements of THGEM PCB are different from those of electronic product PCB, for example, high withstand voltage, high electric fields, small hole pitch and high hole position accuracy, etc. In this paper, we analyze the special requirements of THGEM PCB on PCB material selection, design and process. By comparing the performance data of different types of PCBs, the whole PCB solution are proposed for THGEM production.