基于埋入元器件基板技术的功率模块浅析

Embedded component in PCB solution for power module

随着小型化和高集成度发展趋势成为主流，模块化已经成为行业发展的关键。为满足市场对微型多功能功率管理模块的新兴需求，各厂商纷纷向市场投放功率模块，其除、功率IC外还将输入、输出电容器及输出电感器集成在一个封装内的功率模块。但传统模块的封装形式局限于二维平面内，封装集成度的二维延伸已经到了关键转折点，先进的封装技术要求更高的集成、厚度减薄及成本效益。芯片埋入式技术为在3D结构中集成异质芯片提供了有效解决途径，成为实现三维封装解决方案更具吸引力的集成手段。如今，行业内先进公司纷纷推出采用芯片埋入式技术的新型功率模块，并得到市场的认可。我司凭借自主研发的芯片埋入式技术ECiS（Embedded Componentin bstrate），开发出新型埋入式功率模块，为客户提供高集成度、小型化和低成本解决方案。

With the development of miniaturization and high integration, modularization has become the key to the current industry. New power modules have been introduced in the markets in order to meet the emerging demand. The new power modules integrate not only the power supply 1C, but also the input capacitor, the output inductor and the output capacitor. However, the traditional package methods are confined to the two-dimensional plane. The two-dimensional extension of the integration has reached a critical turning point, new advanced technologies require higher integration, thickness reduction and cost effectiveness. Chip embedded technology provides an effective way to solve the problem of integrated heterogeneous chip in 3D structure, and it becomes a more attractive integration method to realize 3D packaging solution. Nowadays, some companies such as AT＆S, TDK have introduced the new power modules based on their own chip embedded technologies, and get the approval of the market. With the development and independent research of chip embedded technology, our company has introduced a new power module used of our chip embedded technology ECiS, providing customers with a high degree of integration, miniaturization and low cost solution.