高频印制电路铜面平整化修饰技术的研究

Research on the surface smooth modification technology of high frequency Printed Circuit Board

介绍了一种高频印制电路铜面平整化修饰技术，确定了该技术的各个步骤流程：开料→打磨→碱洗→水洗→酸洗→水洗→浸锡→水洗→活化→水洗→硅烷→干燥。并对其中的重要步骤，即化学镀锡，进行了详细的探究，确定了镀液的基本组成及工艺条件。将传统的棕化表面处理技术与该技术进行对比研究，详细分析了平整化修饰处理后铜箔表面锡层厚度、抗剥离强度、表面微细结构以及耐热性等综合性能特征，试验结果表明在抗剥离强度方面达到甚至超越了棕化技术的水平，耐热性等其他性能均达到了高频印制电路板的将性要求。

This paper introduces a smooth surface modification technique which can apply in the field of high frequency printed circuit board. We confirm the process of this modification technology： cutting, burnish, alkaline cleaning, washing, pickling, washing, immersion tin, washing, activation, water, silane, dry. And the most important step in this process--the electroless tin on copper, was studied in this paper, and one of the basic composition of the plating solution and the working conditions was confirmed. Traditional brown oxide was compared with this surface modifieation treatment technology, moreover, the tin layer thickness on the copper foil surface, the peel strength, surface micro structure, heat resistance and other performance characteristics were analyzed in detail, and the experimental results showed that the peel strength of this modification technology reached even beyond the brown oxide technology, heat resistance and other properties were all meet the requirements of the high frequency printed circuit board.