不流动型半固化片性能对刚挠结合板可靠性影响分析

Impact of No-flow PP on reliability of rigid-flex PCB

不流动半固化片作为刚挠结合板的粘结剂，为获得较低的流动性，材料会添加低流动性的分子，这往往会改变材料的PTE值，并影响到刚挠结合板的可靠性能。文章以不流动型半固化片的PTE值作为研究内容，确定不流动型半固化片在不同PTE值下通孔的耐热循环性能，最后通过互联应力测试进行验证，对比找到层间材料的可靠性差异，同时对失效板件进行切片分析，获得了制作高可靠性刚挠结合板的材料选择依据。

As a binder of rigid-flex PCB, No-flow PP will add polymer of low liquidity in order to obtain low liquidity. But it tends to change the PTE of material and affect the reliability of rigid-flex PCB. Based on the PTE of no-flow PP as the research content, the performance of different PTE of No-flow PP was confirmed. Lastly, thermal shock and interconnected stress test experiment was carried out to confirm the validity, get the reliability of the interlayer material differences. And by combining the slice analysis to the defect sample, the research can provide the high reliability rigid-flex PCB material selection basis.