铜浆塞孔工艺研究

Study of plugging process with copper slurry

文章针对铜浆塞孔工艺进行了研究，通过工艺的不断优化解决了丝印塞铜浆的气泡和凹陷问题，同时还设计了一工具板，解决了新工艺铜浆塞孔的批量操作问题。

This article studied copper slurry process. We solved the bubble problem and dimple problem in screen plug copper slurry process by optimizing the plugging process. And we designed a tool for solving the new technology batch operation problems.