LED制备中剥离技术的研究进展

Research Progress of the Lift-off Technology in the Production of LEDs

随着LED芯片功率的增加,结温升高导致传统LED芯片的可靠性和使用寿命明显下降。介绍了LED芯片的研究背景,指出散热问题是制约LED芯片发展的重要因素,因此研发可靠性高的散热技术已成为制备新型LED芯片的重要研究方向。详细论述了三种剥离技术在制备新型LED芯片中所起的重要作用及目前的技术水平。激光剥离技术剥离速度快、发展相对成熟;化学剥离技术对GaN薄膜损伤小、良率高、但剥离速度慢;机械剥离技术良率低,在LED领域应用较少。从工业化生产的角度指出了剥离技术未来的发展方向。

With the increase of the power for LED chips,the increase of the junction temperature can cause the obvious decrease of the reliability and working life.The research background of LED chips is briefly introduced.It is indicated that the heat dissipation problem is an important factor restricting the development of LED chips.Therefore,the heat dissipation technology with high reliability has become an important research direction for the production of the new type LED chips.The important role and the current technology level of three kinds of lift-off technologies in the production of new type LED chips are discussed in detail.The laser lift-off technology has the advantages of high lift-off speed and relatively mature development;the chemical liftoff technology has little damage to GaN films and high yield,but has low lift-off speed;the mechanical lift-off technology is rarely applied in LEDs due to its low yield.The future development direction of the lift-off technology is pointed out from the viewpoint of mass productions.