倒装芯片键合头模态特性研究与实验分析

Modal characteristic research and experimental analysis of flip chip bonding head

键合头是全自动倒装芯片键合机重要的功能运动部件,其主要功能是完成芯片的拾取、点胶和键合。键合头在高频高加速的往复多自由度运动中产生的振动和共振量直接影响芯片的键合精度,因此要求键合头应具有足够的刚度、强度和较好的动态特性。掌握键合头的模态特性及其影响因素之间的关系是自主研发高性能倒装芯片键合头的关键问题。为此,建立键合头模态特性研究系统模型,采用理论计算与实验测试相结合的方法研究键合头在安装工况下的模态特性,将ANSYS有限元仿真的结果与锤击模态试验的结果作一致性对比和分析,得到键合头准确的模态参数、刚度分布情况和影响因素。研究结果为多功能高密度芯片键合头的进一步结构优化和精度控制以及整机的防振、抑振等提供理论支撑和实验依据。

Bonding head in FCB is one of the most important functional components used to deal with the process of chip picking, dispensing, and bonding. Since both resonance and additional vibration in bonding head directly affect the working precision, therefore, it is very meaningful to investigate its vibration characteristics. In order to develop high performance chip bonder, the modality characteristics of bonding head under the assembly condition are investigated by simulation calculation and experiment test. In this paper, the modal characteristic system model is established, and the theory of calculate modality and experimental modality are introduced. Experimental and theoretical analysis results were compared and discussed. Exact modal characteristics, weak link and its influential factors of bonding head are obtained. This research result provides a theoretical support and experiment reference for optimizing structure, preventing resonance and reduces vibration of bonding head.