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降低镀金过程中金盐消耗的方法

Method to Reduce the Consumption of Gold Salt During the Process of Gold Plating
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摘要 将实际金盐消耗量与理论金盐消耗量进行对比,寻找镀金过程中金盐无效消耗的异常点,并通过优化过程参数、控制镀金层厚度、改善镀金层均匀性和控制滴水时间等方面进行管控,形成有效控制方案。理论评估数据显示,对镀金工艺过程参数、镀金层厚度及滴水时间进行有效管控,能有效降低金盐消耗,节省镀金成本。 Through comparing the actual consumption of gold salt with theoretical consumption of gold salt to find the outliers leading to ineffective consumption of gold salt, and effective control scheme was formed through optimizing the process parameters, controlling the gold layer thickness, improving the gold layer uniformity and controlling the dripping time and other aspects of control, etc. Theoretical evaluation data showed that effective control of gold plating process parameters, gold layer thickness and dripping time can effectively reduce the consumption of gold salt and can save the cost of gold plating.
出处 《电镀与环保》 CAS CSCD 北大核心 2016年第6期15-17,共3页 Electroplating & Pollution Control
关键词 电镀金工艺 金盐消耗 镀金层厚度 滴水时间 均匀性 gold plating process consumption of gold salt gold layer thickness dripping time uniformity
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  • 1何丽芳,郭忠诚.无氰仿金电镀的研究现状[J].电镀与涂饰,2006,25(3):51-54. 被引量:20
  • 2陈文亮.电镀仿金工艺的改进和提高[J].电镀与精饰,1987,9(1):18-18.
  • 3赵婉惠 万光忠.无氰镀仿金工艺[J].电镀与精饰,1986,8(5):10-10.
  • 4《电子天府》表面安装技术编写组.实用表面安装技术与元器件[M].成都,1993..
  • 5-.第二届表面贴装技术学会研讨会论文集[M].四川省电子学会SMT专业委员会,1996..
  • 6宣大荣.表面贴装元器件可靠性概论[J].表面贴装技术,1997,(1).
  • 7Abbott, Charles N. Zinc-copper alloy electroplating baths: US, 3 930 965[P]. 1976-06-01.
  • 8Edward Paul Harbulak, Ronald Joseph Lash. Brass plating: GB 1 526 660[P]. 1978-09-27.
  • 9榎本英彦,小见崇.合金电镀[M].朱立群译.北京:航天工业出版社,1989.
  • 10Ameen, Thomas J. Non cyanide brass plating bath and a method of making metallic foil having a brass layer using the non-cyanide brass plating bath:US, 5 762 778[P].1998-06-09.

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