解决SOT3x3-12up产品引脚压扁问题

Resolve clamping burr issue for SOT3x3-12up Product

SOT3X3-12UP是一种引线框上具有高密度器件的产品。对于这种产品,最大的挑战是如何在塑封过程中将引线框在模具上精确定位,否则会导致引脚压扁产生。引脚压扁是一种严重失效,当器件在客户端焊上PCB板时,具有很高的短路风险。本文介绍了在不改变模具设计或更换塑封料的情况下解决引脚压扁的方法,数据证明这种方法低成本并且非常有效。

SOT3X3-12UP is a product with high density of units on leadframe. For this product, it is a big challenge to locate leadframe well on mold die in molding process and consequently, the clamping burr occurs. Clamping burr is critical defect with high risk of shortage when the unit is mounted on PCB at customer site. In this paper, the solution is developed to reduce the clamping burr without changing mold design or molding compound and the data shows it is a very effective with very low cost.