摘要
采用表面覆盖改性技术,利用硬脂酸改性纳米CeO_2,将改性后的纳米m-CeO_2与苯基含氢硅树脂(PH)通过化学接枝制得m-CeO_2-PH接枝物,通过氢化硅烷化法,以接枝物为交联剂,在铂催化剂作用下制备了一种发光二极管(LED)封装用透明m-CeO_2/苯基硅橡胶材料。结果表明:经硬脂酸改性后m-CeO_2表面产生硬脂酸盐,增加了界面的相容性,提高了纳米CeO_2在聚合物中的分散。通过化学方法将m-CeO_2接枝到PH体系中,与苯基乙烯基硅树脂(PV)按化学计量比在催化剂作用下高温固化合成了一种功能型m-CeO_2/苯基硅橡胶材料。研究表明:当m-CeO_2质量分数为0.02%时,m-CeO_2/苯基硅橡胶材料的透光率仍可达到85%以上。同时,耐紫外老化性能和力学性能有明显提高。苯基硅橡胶材料中引入质量分数为0.02%的m-CeO_2,当分解温度到达600℃时,m-CeO_2/苯基硅橡胶材料的热失重比例比纯苯基硅橡胶减少了8%,m-CeO_2/苯基硅橡胶材料的放热量明显低于纯苯基硅橡胶,这对于封装有很大优越性。
By surface covering modification technology,nano CeO_2 was modified by stearic acid,the modified nano m-CeO_2 and phenyl hydrogen containing silicone resin(PH)were chemically graftinged to prepare m-CeO_2-PH grafting.Atransparent m-CeO_2/phenyl-silicone rubber materials used for light-emitting diode(LED)packaging materials were prepared by the method of hydrogenation with grafting as cross-linking agent under the platinum catalyst.The results show that stearic acid salt produces on surface of m-CeO_2 after modified by stearic acid,which increases the compatibility of the interface and improves the dispersion of nano CeO_2 in polymer.m-CeO_2 was grafted in PH system by chemical method,then reacted with phenyl vinyl silicone resin(PV)with stoichiometric ratio under catalyst,and functional m-CeO_2/phenyl-silicone rubber materials were prepared through high temperature curing.Research shows that the light transmission rate of m-CeO_2/phenyl-silicone rubber materials reaches above 85% with0.02% mass fraction of m-CeO_2,and ultraviolet aging properties and mechanical properties increase obviously.In addition when 0.02% mass fraction m-CeO_2 was introduced in phenyl-silicone rubber materials and decomposition temperature of CeO_2/silicone rubber composites is 600 ℃,the thermel gravimetric loss rate of m-CeO_2/phenyl-silicone rubber materials will cut down 8% than pure phenyl-silicone rubber,heat release of m-CeO_2/phenyl-silicone rubber materials is obviously lower than that of pure phenyl-silicone rubber which has superiority for LED packaging materials.
作者
林志远
胡孝勇
柯勇
LIN Zhiyuan HU Xiaoyong KE Yong(College of Biological and Chemical Engineering, Guangxi University of Science and Technology, Liuzhou 545006, Chin)
出处
《复合材料学报》
EI
CAS
CSCD
北大核心
2016年第11期2454-2460,共7页
Acta Materiae Compositae Sinica
基金
广西研究生教育创新计划(YCSZ2015208)
关键词
LED封装材料
二氧化铈
改性二氧化铈
苯基硅橡胶
苯基乙烯基硅树脂
苯基含氢硅树脂
LED packaging materials
cerium oxide
modified cerium oxide
phenyl-silicone rubber
phenyl vinyl silicone resin
phenyl hydrogen containing silicone resin