He-Ne激光陀螺仪真空铟封结构应力分析与工艺优化

Optimization of Indium Sealing Conditions of He-Ne Laser Gyroscope and Stress Analysis

氦氖激光陀螺仪电极封接是维持其微晶玻璃谐振腔体真空环境的关键技术之一。研究分析了氦氖激光陀螺仪经典铟封接结构特点及电极铟封性能,应用弹塑性力学理论建立铟封结构的物理和数学模型。数值计算了铟封结构残余应力,得到了不同物性参数的残余应力变化规律,分析了铟丝环直径、铟合金化学计量比等参数对铟封残余应力的影响;优化了封接工艺参数,提高了封接强度及谐振腔真空铟封性能,使铟封接强度与真空气密性能满足氦氖激光陀螺仪长寿命的使用要求。

Here,we addressed the process optimization ofthenewly-developedindium alloy sealing technique of He-Ne laser gyroscope. First,the novel sealing structures were mathematically modeled and theoretically analyzed in the elastic-plastic theories. Next,the impact of the sealing conditions,including but not limited to the contents and size of indium alloy O-ring,depth of the circular locating groove,and active metal bonding temperature,on the residual stress profile and bonding strength was investigated for the process optimization. Finally,the residual stress and bonding strength of the indium sealing structure were significantly improved via process optimization. The preliminary results show that the newly-developed indium sealing technique is capable of accurately sealing the He-Ne lasergyroscope with strong bonding strength and high durability.