Ni元素对Sn-9Zn-3Bi无铅钎料显微组织和性能的影响

Effect of Ni Element on Microstructure and Properties of Sn-9Zn-3Bi Lead-free Solder

利用真空箱式电阻炉制备了Sn-9Zn-3Bi-xNi无铅钎料合金,并对其显微组织和主要性能(熔点、熔程、抗氧化性、润湿性、剪切强度)及钎焊接头断口形貌进行了分析。结果表明,少量Ni的加入可以细化Sn-9Zn-3Bi合金的显微组织,而对其熔点影响较小。当Ni添加量为0.1%和0.5%时,钎料的熔程变化不大,Ni添加量为1%时,钎料的熔程增大比较明显。随着Ni添加量增多,无铅钎料的抗氧化性能和润湿性能提高。Ni添加量在0.1%和0.5%时,钎焊接头的剪切强度变化不大,但韧性增加;Ni添加量在1%时,钎焊接头的剪切强度略有增大,但韧性降低。

The Sn-9Zn-3Bi-xNi lead-free solder alloy was successfully prepared in the vacuum box resistance furnace and its microstructure,main properties （melting point,melting range,oxidation resistance,wettability,shear strength）and welding fractography were analyzed.The results showed that a few Ni addition could refine the micro-structure of Sn-9Zn-3Bi alloy and slightly affect melting point.The solder melting range had little change when the Ni addition amount was 0.1% or 0.5%,but it varied obviously when the Ni addition amount was 1%.Both oxidation re-sistance and wettability of the alloy could be improved with the increasing Ni amount.Shear strength of the alloy had little change and the toughness could be enhanced when the Ni addition amount was 0.1% and 0.5%.The shear strength of the alloy increased slightly but the toughness decreased when the Ni addition amount was 1%.