摘要
基于ABAQUS有限元分析软件,利用子模型法,对四边扁平封装(QFP)器件在热循环载荷下的应力场进行了研究,比较了不同引线宽度、引线间距、引线高度等参数对QFP封装器件应力场的影响规律。结果表明,在热循环载荷条件下,QFP封装应力集中区域位于焊点的根部以及焊趾部位,且最大应力位置出现在焊点根部,即焊点最内侧的尖角处;QFP封装的最大应力值与引线间距成正比,与引线宽度和引线高度成反比;利用子模型法,可以方便地对复杂模型中的关键部件进行较准确的分析。
The stress field of QFP under the thermal cyclic loading was analyzed by submodel method based on the ABAQUS software.The influence regularities of different widths,distances and heights of lead on the stress field of QFP were studied.The results indicated that,under the thermal cyclic loading,stress concentration areas of QFP located at the sharp corners of interior and exterior part of the solder joints,and the maximum stress focused on the sharp corner of interior part of the solder joint.The maximum stress of QFP was in direct proportion to the distance of lead and in inverse proportion to the width and height of lead.The stress field of key component in complex model could be analyzed accurately by submodel method.
基金
国家自然科学基金(51305268)
航空科学基金(20110247001)
关键词
子模型
热应力
四边扁平封装
影响规律
submodel
thermal stress
quad flat packaging
influence regularities
