HDI电路板不同介质层厚径比电镀参数浅析

Analysis about the effect of different HDI dielectric aspect ratio on plating parameter

主要浅析HDI电路板在填孔电镀中,针对不同介质层厚度,填孔电镀参数对微盲孔填充效果的影响,以及高厚径比HDI电路板采用填孔电镀与闪镀相结合的工艺,对其微盲孔填充效果与通孔孔壁铜厚的影响。

This article is mainly analyzing, in HDI copper planarization plating, how plating parameter affecting the micro via copper filling quality under different dielectric thickness, and the impact on micro via copper filling quality and copper thickness in high aspect ratio HD! when adopting the copper planarization plating and flash plating process.