对一种新型铜面附着增强剂性能的研究

Studies about a kind of new adhesive strengthener of cuprous surface

介绍了一种新型铜面附着增强剂,并将它与以往的四种微蚀剂对了对比,从中得出以下结论:RS-895是一种优良铜面附着增强剂,它在不改变基铜和镀层的结构和性能的同时,增强铜面附着力,完全适应于高密度多层板的制作很高的性价比,对环境友好,药液稳定,用它代替以往的微蚀剂。

This text introduced a newly adhesive strengthener of cuprous surface, and the contrast b with the former four kinds micro etchants. We draw a conclusion from contrast： RS-895 is a excellent adhesive strengthener of cuprous surface, which does not change copper foil and plating cuprous layer＇structure and function. In the meanwhile it strengthens cuprous bonding force, and fits for manufacturing HID completely. It has very high functional cost saving and is non pollution with stability, which can replace former of micro etchant.