研磨液对硅片加工的发展前景

Development Prospect of Grinding Fluid for Silicon Wafer Processing

在硅片研磨过程中,由于应力的积累和剧烈的机械作用,硅片表面损伤严重,碎片率增加;通过改进研磨液,不但可以把剧烈的机械作用转变为比较缓和的化学、机械作用,还能起到其他较好的辅助作用并对其各成分作用,进行了理论分析,得到了硅片表面状态的改善和提高生产效率的结果。

In the process of silicon wafer lapping,due to the accumulation of stress and the violent mechanical action,the surface of the silicon wafer is seriously damaged,and the rate of debris is increased. This paper investigates the improvement of lapping fluid,not only can the intense mechanical action be changed into a comparative ease of chemical,mechanical action,but also it plays a good auxiliary role,with the theoretical analysis of the function of each component,the silicon wafer surface state has been improved to a certain extent,and the production efficiency is improved.