摘要
以全自动精密组装设备为例,从设备的机械结构、控制结构、软件设计、工艺设计等方面,对芯片拾放精度的影响因素做了详细分析,并指出解决办法。这些理论和方法可在全自动贴片机、点胶机、晶圆芯片拾取机等设备中进一步验证。
The paper is directed against the Ultra-Precision Assembly Workcell＇s mechanical structure、electric control、software、progress design,discusses the Influencing Precisely Factor. And points out the resolving method. They can apply to accurately picking and placing chip. These methods is appropriate for Die Bonder、Dispenser machine、Wafer Die Picking and Placing machine,etc.
出处
《电子工业专用设备》
2016年第11期34-37,共4页
Equipment for Electronic Products Manufacturing
关键词
芯片拾放
影响因素
高精度
Picking and placing chip
Influencing factor
High-precision
