摘要
采用酚酞基聚芳醚酮为增韧剂改性环氧树脂,以芳香胺为固化剂,制备出一种改性环氧树脂。研究了改性树脂的耐热性和微观结构。实验结果表明:随着酚酞基聚芳醚酮用量的增加,改性树脂的玻璃化转变温度先增高后降低,当酚酞基聚芳醚酮用量为15phr时,改性树脂的玻璃化转变温度最高,达到193℃。同时,改性树脂的微观结构随着PEK-C用量增加而发生变化。由海岛结构先转变成双连续互锁结构,最终发生相反转。
A modified epoxy was prepared. The epoxy was modified by poly ether ketone-cadro （PEK-C） as toughener and aromatic amine as curing agent. The heat resistance and microstructure of the modified resin were studied. The result showed that the glass transition temperature of the modified resin increased firstly and then decreased with the increase of the dosage of PEK-C. When the PEK-C content was 15phr, the glass transition temperature was 193℃ which was the highest. And the microstructure of the modified resin would change with the increase of the amount of PEK-C. The phase structure converted from sea-island structure to double continuous interlocking structure, and finally the phase inversion occurred.
出处
《化学与粘合》
CAS
2016年第6期427-429,436,共4页
Chemistry and Adhesion
基金
黑龙江省科学院青年创新基金重点项目
关键词
酚酞基聚芳醚酮
环氧树脂
增韧
耐热性
相态
Poly （aryl ether ketone）
epoxy adhesive
toughening
heat resistance
phase state
