聚乙二醇对钢板甲基磺酸盐镀锡层性能的影响

Influences of Polyethylene Glycol Additive in Methyl Sulfonate on Properties of Tin Plating Layer on Steel Plates

甲基磺酸盐(MSA)体系电镀锡过程中电镀添加剂含量会随生产的进行产生较大波动,从而影响镀锡板的性能。采用含聚乙二醇的MSA体系对RF低碳钢板电镀锡,采用电化学极化曲线、交流阻抗、中性盐雾和附着力等测试,系统地研究了所得镀锡板的耐蚀性和附着力等性能,考察了镀液中聚乙二醇含量对镀液及镀锡板综合性能的影响。结果表明:镀液中加入聚乙二醇可降低镀液表面张力并提高其稳定性,能改善镀锡板的附着性,能增强镀层耐蚀性;但聚乙二醇含量过高会降低镀锡层质量,其含量为0.2%左右为宜。

In methyl sulfonate system containing polyethylene glycol additive,tin layers were electrochemically plated on mild steel plate.The performance including corrosion resistance and adhesion force of the tinplate was tested by electrochemical polarization curves,alternating current impedance,neutral salt spray and adhesion tests.Results showed that the polyethylene glycol additive lowered the surface tension of the plate solution and improved its stability.Besides,the adhesion of tin plating layer and the corrosion resistance were enhanced.However,if the concentration of polyethylene glycol was too large,the quality of tin plating layer was reduced.Generally,the proper concentration of polyethylene glycol was around 0.2%.