电子接插件连续电镀故障信息的分析与监测

Fault Information Analysis and Monitor of Electronic Connector Continuous Plating

电子接插件连续电镀过程容易出现故障,当前故障信息分析与监测方法处理速度慢,且采集与传输电镀故障数据时容易受到干扰,导致故障监测结果不可靠。设计了一种电子接插件连续电镀故障信息监测器,分析了电子接插件连续电镀工艺,对电子接插件连续电镀工艺流程中的关键工序进行分析,以电镀Fe-Cr合金电子接插件为例,给出中间层电镀工艺条件的故障影响参数,通过正交试验对故障因素进行选择,去除Fe-Cr合金中间镀层中的故障检测干扰。设计出故障监测器的总体结构,分析了核心处理器MSP430F169、无线通信模块和SD卡存储电路的设计过程。实验结果表明,所设计监测器不仅具有很高的监测精度,而且能耗较低。

Electronic connector continuous plating process is easy to find fault,the processing speed of current fault information analyzing and monitoring methods is slow and the plating failure data acquisition and transmission are easy to be disturbed,so the unreliable failure monitoring results may be caused. In this paper,an electronic connector continuous plating fault information monitor was designed; the electronic connector continuous plating process was analyzed; the key working procedure of the electronic connector continuous plating process was studied in details. Taking Fe-Cr alloy electronic connector as sample,the fault impacting parameters of middle layer plating process were presented; fault detection interference of the Fe-Cr alloy middle layer was removed through selecting the reasonable fault factors by orthogonal tests. The over structure of the designed fault monitor was presented; the designing process of core microprocessor MSP430F169,wireless communication module and SD card storage circuit were analyzed in details. The experimental results showed that the designed monitor not only had high monitoring precision,but also had low energy consumption.