摘要
现阶段的光模块封装类型已从小型可插拔(SFP)系列逐渐向100Gb/s可插拔(CFP)系列和4通道SFP(QSFP)系列过渡,传输速率最高可达400Gb/s,发射端激光器消光比大于9dB,光波分复用器插入损耗小于1dB,发射功率大于0.3dBm,接收端探测器响应度为0.7A/W,接收灵敏度小于-17dBm。阐述了在数据中心光互连中可以应用于IEEE制定的40/100GbE标准802.3ba的发射和接收集成芯片,主要包括分立器件组装芯片、混合集成芯片和单片集成芯片,介绍了其各种类型的基本结构和特性。
At present the optical module package types have been changed gradually from small form-factor pluggable （SFP） series to centum form-factor pluggable （CFP） and quad SFP （QSFP） series. Transmission rate is up to 400 Gb/s. Transmitting lasersr extinction ratio （ER） is more than 9 dB. Optical wavelength division multiplexersrinsert loss （IL） is less than 1 dB. Transmitting power is more than 0.3 dBm. Receiving detectorrs responsivity is 0.7 A/W and receiving sensitivity is less than - 17 dBm. Transmitting and receiving integrated chips in the data center, which can be applied on the 40/100 GbE, standardized as IEEE 802.3 be, is demonstrated, including the discrete devices assembly chip, hybrid integration chip and monolithic integration chip, whose basic structures and characteristics are introduced as well.
出处
《激光与光电子学进展》
CSCD
北大核心
2016年第12期11-21,共11页
Laser & Optoelectronics Progress
基金
国家863计划(2015AA016902)
国家重点研发计划(2016YFB0402504)
国家自然科学基金面上项目(61274047)
国家自然科学基金重点项目(61435013)
国家自然科学青年基金(61307034
61205044)
关键词
光学器件
硅光子
波分复用
阵列波导光栅
数据中心
optical devices
silicon photonics
wavelength division multiplexer
arrayed waveguide grating
data center
